Dichlorosilane

Dichlorosilane
Stereo, skeletal formula of dichlorosilane with some explicit hydrogens added
Ball and stick model of dichlorosilane
Ball and stick model of dichlorosilane
Spacefill model of dichlorosilane
Spacefill model of dichlorosilane
Names
IUPAC name
Dichlorosilane[1]
Other names
Silylene dichloride
Identifiers
3D model (JSmol)
Abbreviations DCS[citation needed]
ChemSpider
ECHA InfoCard 100.021.717 Edit this at Wikidata
EC Number
  • 223-888-3
MeSH dichlorosilane
RTECS number
  • VV3050000
UN number 2189
  • InChI=1S/Cl2H2Si/c1-3-2/h3H2 checkY
    Key: MROCJMGDEKINLD-UHFFFAOYSA-N checkY
  • Cl[SiH2]Cl
Properties
SiH
2Cl
2
Molar mass 101.007 g mol−1
Appearance Colourless gas
Density 4.228 g cm−3
Melting point −122 °C (−188 °F; 151 K)
Boiling point 8 °C; 46 °F; 281 K at 101 kPa
Reacts
Vapor pressure 167.2 kPa (at 20 °C)
Thermochemistry
286.72 J K−1 mol−1
−320.49 kJ mol−1
Hazards
GHS labelling:
GHS02: FlammableGHS05: CorrosiveGHS06: Toxic
Danger
H220, H250, H280, H314, H330
P210, P261, P305+P351+P338, P310, P410+P403
NFPA 704 (fire diamond)
NFPA 704 four-colored diamondHealth 4: Very short exposure could cause death or major residual injury. E.g. VX gasFlammability 4: Will rapidly or completely vaporize at normal atmospheric pressure and temperature, or is readily dispersed in air and will burn readily. Flash point below 23 °C (73 °F). E.g. propaneInstability 2: Undergoes violent chemical change at elevated temperatures and pressures, reacts violently with water, or may form explosive mixtures with water. E.g. white phosphorusSpecial hazard W: Reacts with water in an unusual or dangerous manner. E.g. sodium, sulfuric acid
4
4
2
W
Flash point −37 °C (−35 °F; 236 K)
55 °C (131 °F; 328 K)[2]
Explosive limits 4.1–99%
Safety data sheet (SDS) inchem.org
Related compounds
Monochlorosilane
Trichlorosilane

Silicon tetrachloride

Related compounds
 Dichloromethane
Except where otherwise noted, data are given for materials in their standard state (at 25 °C [77 °F], 100 kPa).
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Dichlorosilane, or DCS as it is commonly known, is a chemical compound with the formula H2SiCl2. In its major use, it is mixed with ammonia (NH3) in LPCVD chambers to grow silicon nitride in semiconductor processing. A higher concentration of DCS·NH3 (i.e. 16:1), usually results in lower stress nitride films.

  1. ^ "nchem.403-comp13 - Compound Summary". PubChem Compound. USA: National Center for Biotechnology Information. 27 March 2005. Identifiers and Related Records. Retrieved 30 November 2011.
  2. ^ "Welcome on the new Gas Encyclopedia". 15 December 2016.