Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards. Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a surface-mount technology, one of several package technologies that connect ICs to the surfaces of PCBs without through-holes. Flat no-lead is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate. Perimeter lands on the package bottom provide electrical connections to the PCB.[1] Flat no-lead packages usually, but not always, include an exposed thermally conductive pad to improve heat transfer out of the IC (into the PCB). Heat transfer can be further facilitated by metal vias in the thermal pad.[2] The QFN package is similar to the quad-flat package (QFP), and a ball grid array (BGA).
- ^ Design requirements for outlines of solid state and related products, JEDEC PUBLICATION 95, DESIGN GUIDE 4.23
- ^ Bonnie C. Baker, Smaller Packages = Bigger Thermal Challenges, Microchip Technology Inc.