Huatian Technology

Tianshui Huatian Technology Co., Ltd.
Native name	天水华天科技股份有限公司
Company type	Public; State-owned enterprise
Traded as	SZSE: 002185
Industry	Semiconductors
Predecessor	Yonghong Appliance Factory
Founded	December 25, 2003; 20 years ago
Founder	Xiao Shengli
Headquarters	Tianshui, Gansu, China
Key people	Xiao Shengli (Chairman); Cui Weibing (CEO)
Revenue	CN¥11.30 billion (2023)
Net income	CN¥278.10 million (2023)
Total assets	CN¥33.75 billion (2023)
Total equity	CN¥19.12 billion (2023)
Number of employees	26,427 (2023)
Subsidiaries	Flipchip; Unisem
Website	www.ht-tech.com
	Footnotes / references;

Huatian Technology (HT-Tech; Chinese: 华天科技; pinyin: Huátiān Kējì) is a partially state-owned publicly listed Chinese semiconductor company headquartered in Tianshui, Gansu.

It is one of the largest Outsourced Semiconductor Assembly and Test (OSAT) companies in mainland China. It has a focus on developing advanced packaging technologies such as SiP, TSV, Fan-Out and WLP.^[2]

^ "2023 Annual Report" (PDF). Sohu.
^ Hsiao, Jingyue (26 September 2024). "Tongfu Microelectronics and Tianshui Huatian invest in advanced packaging in China". DIGITIMES. Retrieved 1 November 2024.

[AR23-1] "2023 Annual Report" (PDF). Sohu.

[:2-2] Hsiao, Jingyue (26 September 2024). "Tongfu Microelectronics and Tianshui Huatian invest in advanced packaging in China". DIGITIMES. Retrieved 1 November 2024.

[1]

[2]