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Native name | 龙芯中科技术有限公司 |
|---|---|
| Company type | Public, Mixed ownership enterprise |
| SSE: 688047 | |
| Industry | Semiconductor technology industry |
| Founded | April 2010 |
| Founder | Hu Weiwu |
| Headquarters | People's Republic of China Loongson Industrial Park, Building 2, Zhongguancun Environmental protection park, Haidian District, Beijing, China |
Area served | Global |
Key people | Hu Weiwu (Chairman) |
| Services | Chip design, motherboard design, operating system and kernel maintenance, important software and library maintenance |
Number of employees | More than 400 (estimate) |
| Website | www |
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| General information | |
|---|---|
| Marketed by | Loongson Technology, Jiangsu Lemote Tech Co., Ltd, Dawning Information Industry, and others |
| Designed by | Institute of Computing Technology (ICT), Chinese Academy of Sciences, Loongson Technology, Jiangsu Lemote Tech Co., Ltd |
| Common manufacturer | |
| Performance | |
| Max. CPU clock rate | 800 MHz to 2.0 GHz |
| HyperTransport speeds | 800 MHz to 3.0 GHz |
| Architecture and classification | |
| Application | Desktop, Server, Supercomputer, Industrial Device, Embedded Device, Aerospace |
| Technology node | 180 nm to 12 nm |
| Microarchitecture | see text |
| Instruction set |
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| Physical specifications | |
| Cores |
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Loongson (simplified Chinese: 龙芯; traditional Chinese: 龍芯; pinyin: Lóngxīn; lit. 'Dragon Core')[1] is the name of a family of general-purpose, MIPS architecture-compatible, later in-house LoongArch architecture microprocessors, as well as the name of the Chinese fabless company (Loongson Technology) that develops them. The processors are alternately called Godson processors,[2] which is described as its academic name.[3]
- ^ "龙芯处理器英文品牌定名Loongson(组图)_业界_科技时代_新浪网". tech.sina.com.cn. Archived from the original on 9 July 2011. Retrieved 19 November 2006.
- ^ Cite error: The named reference
2005-huwas invoked but never defined (see the help page). - ^ Hu, Weiwu (August 2008). "Micro-architecture of Godson-3 multi-core processor". 2008 IEEE Hot Chips 20 Symposium (HCS). pp. 1–31. doi:10.1109/HOTCHIPS.2008.7476554. ISBN 978-1-4673-8871-9. S2CID 38427069. Archived from the original on 2 August 2021. Retrieved 2 August 2021.