Automated optical inspection (AOI) is an automated visual inspection of printed circuit board (PCB) (or LCD, transistor) manufacture where a camera autonomously scans the device under test for both catastrophic failure (e.g. missing component) and quality defects (e.g. fillet size or shape or component skew). It is commonly used in the manufacturing process because it is a non-contact test method. It is implemented at many stages through the manufacturing process including bare board inspection, solder paste inspection (SPI), pre-reflow and post-re-flow as well as other stages.[1]
Historically, the primary place for AOI systems has been after solder re-flow or "post-production." Mainly because, post-re-flow AOI systems can inspect for most types of defects (component placement, solder shorts, missing solder, etc.) at one place in the line with one single system. In this way the faulty boards are reworked and the other boards are sent to the next process stage.[2]
- ^ Vitoriano, Pedro. "3D Solder Joint Reconstruction on SMD based on 2D Images". Academia.edu. Retrieved 4 December 2021.
- ^ Vitoriano, Pedro M. A.; Amaral, Tito G.; Dias, Octavio Pascoa (4 December 2011). "Automatic Optical Inspection for Surface Mounting Devices with IPC-A-610D compliance". 2011 International Conference on Power Engineering, Energy and Electrical Drives. pp. 1–7. doi:10.1109/PowerEng.2011.6036444. ISBN 978-1-4244-9845-1. S2CID 24824082. Retrieved 4 December 2021.