Loongson

Loongson Technology Corporation Limited
Native name
龙芯中科技术有限公司
Company typePublic, Mixed ownership enterprise
SSE: 688047
IndustrySemiconductor technology industry
FoundedApril 2010; 14 years ago (2010-04)
FounderHu Weiwu [zh]
HeadquartersPeople's Republic of China
Loongson Industrial Park, Building 2, Zhongguancun Environmental protection park, Haidian District, Beijing, China
Area served
Global
Key people
Hu Weiwu
(Chairman)
ServicesChip design, motherboard design, operating system and kernel maintenance, important software and library maintenance
Number of employees
More than 400 (estimate)
Websitewww.loongson.cn Edit this at Wikidata
Loongson
General information
Marketed byLoongson Technology, Jiangsu Lemote Tech Co., Ltd, Dawning Information Industry, and others
Designed byInstitute of Computing Technology (ICT), Chinese Academy of Sciences, Loongson Technology, Jiangsu Lemote Tech Co., Ltd
Common manufacturer
Performance
Max. CPU clock rate800 MHz to 2.0 GHz
HyperTransport speeds800 MHz to 3.0 GHz
Architecture and classification
ApplicationDesktop, Server, Supercomputer, Industrial Device, Embedded Device, Aerospace
Technology node180 nm to 12 nm
Microarchitecturesee text
Instruction set
  • MIPS64 (with LoongISA extensions)
  • LoongArch
Physical specifications
Cores
  • 1–8

Loongson (simplified Chinese: 龙芯; traditional Chinese: 龍芯; pinyin: Lóngxīn; lit. 'Dragon Core')[1] is the name of a family of general-purpose, MIPS architecture-compatible, later in-house LoongArch architecture microprocessors, as well as the name of the Chinese fabless company (Loongson Technology) that develops them. The processors are alternately called Godson processors,[2] which is described as its academic name.[3]

  1. ^ "龙芯处理器英文品牌定名Loongson(组图)_业界_科技时代_新浪网". tech.sina.com.cn. Archived from the original on 9 July 2011. Retrieved 19 November 2006.
  2. ^ Cite error: The named reference 2005-hu was invoked but never defined (see the help page).
  3. ^ Hu, Weiwu (August 2008). "Micro-architecture of Godson-3 multi-core processor". 2008 IEEE Hot Chips 20 Symposium (HCS). pp. 1–31. doi:10.1109/HOTCHIPS.2008.7476554. ISBN 978-1-4673-8871-9. S2CID 38427069. Archived from the original on 2 August 2021. Retrieved 2 August 2021.