Socket SP3

Socket SP3

Release date	June 20, 2017 (2017-06-20)
Designed by	AMD
Manufactured by	Lotes Foxconn
Type	LGA-ZIF
Chip form factors	Flip-chip
Contacts	4094
FSB protocol	PCI Express, Infinity Fabric
Voltage range	1.8V (Threadripper) 1.3V (EPYC)
Processor dimensions	58.5mm x 75.4mm 4410.9 mm2
Processors	Epyc: Naples Rome Milan
Predecessor	Socket C32 Socket G34
Successor	Socket SP5 Socket SP6
Memory support	ECC DDR4
This article is part of the CPU socket series

Socket SP3 is a zero insertion force land grid array CPU socket designed by AMD supporting its Zen-, Zen 2- and Zen 3-based Epyc server processors,^[1][2] launched on June 20, 2017.^[3] Because the socket is physically the same size as socket TR4 and socket sTRX4, users can use CPU coolers not only designed for SP3, but also coolers designed for TR4 and sTRX4.

Socket SP3 is a system in a package socket - that means most features required to make the system fully functional (such as memory, PCI Express, SATA controllers etc.) are fully integrated into the processor package, eliminating the need for a chipset to be placed on a motherboard. Variants for desktop platforms (as said below) are, eventually, requiring an additional chipset to unlock the functionality of the CPU. A processor using socket SP3 is mounted by inserting the CPU into a slide and fixing the slide assembly by tightening three screws using the torque wrenches normally provided alongside the motherboard. Automated processor mounting tools in OEMs do not use the slide, instead relying upon the precision movement of the robot arm.