Substrate-integrated waveguide

"SIW" redirects here. For other uses, see SIW (disambiguation).
Substrate-integrated waveguide. The propagating electromagnetic waves are confined within the substrate by the metallic layers on each of the two faces of the substrate and between two rows of metallic vias connecting them.

A substrate-integrated waveguide (SIW) (also known as post-wall waveguide or laminated waveguide) is a synthetic rectangular electromagnetic waveguide formed in a dielectric substrate by densely arraying metallized posts or via holes that connect the upper and lower metal plates of the substrate. The waveguide can be easily fabricated with low-cost mass-production using through-hole techniques, where the post walls consists of via fences. SIW is known to have similar guided wave and mode characteristics to conventional rectangular waveguide with equivalent guide wavelength.

Since the emergence of new communication technologies in the 1990s, there has been an increasing need for high-performance millimeter-wave systems. These need to be reliable, low-cost, compact, and compatible with high-frequencies. Unfortunately, above 10 GHz, the well known microstrip and coplanar lines technologies cannot be used because they have high insertion and radiation losses at these frequencies. The rectangular waveguide topology can overcome these issues, as it offers an excellent immunity against radiation losses and presents low insertion losses. But in their classical form, rectangular waveguide is not compatible with the miniaturization required by modern applications.[1]

The concept of SIW was developed in the early 2000s by Ke Wu to reconcile those requirements.[1][2] The authors presented a platform for integrating all the components of a microwave circuit inside a single substrate, with a rectangular cross-section. Using a single substrate guarantees a limited volume and a simplicity of manufacture, while the rectangular cross-section of the line provides the advantages of the waveguide topology in terms of losses.

  1. ^ a b Ke Wu; Desiandes, D.; Cassivi, Y. (2003). "The substrate integrated circuits - a new concept for high-frequency electronics and optoelectronics". 6th International Conference on Telecommunications in Modern Satellite, Cable and Broadcasting Service, 2003. TELSIKS 2003. Vol. 1. Serbia, Montenegro, Nis: IEEE. pp. P-III–P-X. doi:10.1109/TELSKS.2003.1246173. ISBN 978-0-7803-7963-3. S2CID 17010281.
  2. ^ Deslandes, D.; Ke Wu (2001). "Integrated transition of coplanar to rectangular waveguides". 2001 IEEE MTT-S International Microwave Sympsoium Digest (Cat. No.01CH37157). Vol. 2. Phoenix, AZ, USA: IEEE. pp. 619–622. doi:10.1109/MWSYM.2001.966971. ISBN 978-0-7803-6538-4. S2CID 34119831.