Names | |
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Other names
Tantalum mononitride
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Identifiers | |
3D model (JSmol)
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ECHA InfoCard | 100.031.613 |
EC Number |
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PubChem CID
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CompTox Dashboard (EPA)
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Properties | |
TaN | |
Molar mass | 194.955 g/mol |
Appearance | black crystals |
Density | 14.3 g/cm3 |
Melting point | 3,090 °C (5,590 °F; 3,360 K) |
insoluble | |
Structure | |
Hexagonal, hP6 | |
P-62m, No. 189 | |
Hazards | |
Flash point | Non-flammable |
Related compounds | |
Other cations
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Vanadium nitride Niobium nitride |
Except where otherwise noted, data are given for materials in their standard state (at 25 °C [77 °F], 100 kPa).
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Tantalum nitride (TaN) is a chemical compound, a nitride of tantalum. There are multiple phases of compounds, stoichimetrically from Ta2N to Ta3N5, including TaN.
As a thin film TaN find use as a diffusion barrier and insulating layer between copper interconnects in the back end of line of computer chips. Tantalum nitrides are also used in thin film resistors.